XG-30 lead-free solder paste is designed for reliable and efficient electronic soldering and repair. With a medium temperature melting point of 183°C, it delivers smooth solder flow, strong adhesion, and clean joints during SMT, PCB, SMD, and BGA applications.
This solder paste features excellent wettability and stable viscosity, making it easy to apply without splashing or residue buildup. It is suitable for precision electronic repairs, mobile phone maintenance, circuit board rework, and component soldering. The lead-free formula is safer for users and compliant with modern electronics standards. Packed in a sealed 16g container to maintain freshness and performance.