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Imefadhiliwa
Nairobi, Nairobi Kati, siku 1 zilizopita
5 maoni
Bga Solder Paste for Phone Motherboard Electronics Chips Repair
LD
Chapa
BGA Solder Paste
Aina
Chapa Mpya
Hali
Bga solder paste 20ml maintenance of csp/bga
specific gravity range is 0.85-1.0. it is molding agent / organic acid / synthetic acid / acid inhibitor / stabilizer
thickener ithixotropic agentisurfactant i resin /high amixture of boiling point solvents, usually weakly acidic
packed in a solder paste bottle (0, 15l), filled to about three-quarters of a hundred grams! has a certain viscosity /
high resistance / requires no-wash! lead and non-lead with solder paste, it is widely used in bga chip packaging.
instructions for use
suitable for sensors, wires, motors, fuses, connectors, metal shells, lighting, electronics,
smt repairs, bga chip planting, etc.can be used for welding on general instruments, meters
copper, tin, iron and other metals
Vidokezo vya Usalama
- Usilipe mapema hata kama ni ada ya kusafirishiwa bidhaa
- Kutana na muuzaji mahali salama pa umma
- Kagua kipengee na uhakikishe ni nini hasa unachotaka
- Hakikisha kwamba bidhaa uliyofungiwa ni ile ambayo uliagiza
- Lipa tu ikiwa umeridhika
